Fairchild flatpack metalization effect on EASEP

Andreasen, K. D.

dc.contributor.author	Andreasen, K. D.
dc.date.accessioned	2015-09-09T22:30:43Z
dc.date.available	2015-09-09T22:30:43Z
dc.date.issued	1969
dc.identifier.other	31111000672715
dc.identifier.uri	https://hdl.handle.net/20.500.11753/584
dc.description.abstract	The purpose of this EATM is to document the results of a special reliability assessment test which was performed to determine to what extent the internal metalization problem reported in ATM 806 would have on Fairchild LPDTL integrated circuits in the EASEP environment.
dc.description.statementofresponsibility	prepared by K. Andreasen.
dc.format.extent	12 leaves
dc.format.mimetype	application/pdf
dc.language.iso	en
dc.publisher	Bendix Aerospace Systems Division
dc.relation.ispartofseries	EATM
dc.source.uri	https://www.lpi.usra.edu/lunar/ALSEP/pdf/31111000672715.pdf
dc.subject.lcc	TL789.8.U6A5
dc.subject.lcsh	Early Apollo Scientific Experiments Package
dc.subject.lcsh	Integrated circuits
dc.title	Fairchild flatpack metalization effect on EASEP
dc.title.alternative	Fairchild flatpack metalization effect on Early Apollo Scientific Experiments Package